Keyphrases
Plasma Treatment
100%
Surface Modification
100%
Radio Frequency
100%
Dielectric Barrier Discharge Plasma
100%
Polytetrafluroethylene
100%
Surface Microstructure
40%
Contact Angle
40%
Surface Chemistry
40%
Surface Wettability
40%
Energy Dose
40%
Treated Surface
40%
Scission
40%
Radio Frequency Plasma
40%
Oligomeric
40%
High Energy
20%
Low Energy
20%
Slow Recovery
20%
Vacuum Arc Plasma
20%
Microstructure Change
20%
High Vacuum
20%
Recovery Stage
20%
Wettability Alteration
20%
Chemistry Changes
20%
Tetrafluoroethylene
20%
Etching Effect
20%
Steady Stage
20%
Angle Variation
20%
Plasma Frequency
20%
Material Science
Surface
100%
Surface Treatment
100%
Dielectric Material
100%
Microstructure
25%
Contact Angle
25%
Wettability
25%
Physics
Wettability
40%
Plasma Frequency
40%
Cleavage
40%
High Vacuum
20%