Keyphrases
High-resolution
100%
Multi-channel
100%
Environmental Applications
100%
High Strength
100%
On-chip Devices
100%
Thermoplastic Bonding
100%
Ocean Applications
100%
Bond Strength
66%
Chloroform
66%
Channel Features
66%
Low Temperature
33%
High Performance
33%
Prior Exposure
33%
Double-sided
33%
Bond Performance
33%
Bonding Process
33%
Vertical Wall
33%
Great Depth
33%
Multiple Layers
33%
Channel Depth
33%
Glass Transition Temperature
33%
Harsh Environmental Conditions
33%
Wall Thickness
33%
Leak Test
33%
Performance Loss
33%
Tensile Bond Strength
33%
Solvent Permeation
33%
Multilayer Microfluidic Device
33%
Patterned Substrate
33%
Performance Bonds
33%
Exposure Process
33%
Channel Alignment
33%
Deep Reduction
33%
Lab-on-a-chip
33%
Burst Test
33%
Interlayer Bonding
33%
Single-side
33%
Solvent Vapor
33%
Bond Integrity
33%
Shear Bond Strength
33%
Thermal Fusion
33%
Serpentine Structure
33%
Wall Integrity
33%
Engineering
Substrates
100%
Application
100%
High Resolution
100%
Multichannel
100%
Bond Strength
100%
High Strength
100%
Chip Device
100%
Loss
66%
Reduction
66%
Performance Bond
66%
Temperature
33%
Demonstrates
33%
Performance
33%
Environmental Condition
33%
Low-Temperature
33%
Thickness
33%
Shallower
33%
Tensiles
33%
Alignment
33%
Large Area
33%
Bonding Process
33%
Microfluidic Device
33%
Transition Temperature
33%
Area Substrate
33%
Bonding Layer
33%
Channel Depth
33%
Prior Exposure
33%