High-strength thermoplastic bonding for multi-channel, multi-layer lab-on-chip devices for ocean and environmental applications

Keyphrases

• High-resolution 100%
• Multi-channel 100%
• Environmental Applications 100%
• High Strength 100%
• On-chip Devices 100%
• Thermoplastic Bonding 100%
• Ocean Applications 100%
• Bond Strength 66%
• Chloroform 66%
• Channel Features 66%
• Low Temperature 33%
• High Performance 33%
• Prior Exposure 33%
• Double-sided 33%
• Bond Performance 33%
• Bonding Process 33%
• Vertical Wall 33%
• Great Depth 33%
• Multiple Layers 33%
• Channel Depth 33%
• Glass Transition Temperature 33%
• Harsh Environmental Conditions 33%
• Wall Thickness 33%
• Leak Test 33%
• Performance Loss 33%
• Tensile Bond Strength 33%
• Solvent Permeation 33%
• Multilayer Microfluidic Device 33%
• Patterned Substrate 33%
• Performance Bonds 33%
• Exposure Process 33%
• Channel Alignment 33%
• Deep Reduction 33%
• Lab-on-a-chip 33%
• Burst Test 33%
• Interlayer Bonding 33%
• Single-side 33%
• Solvent Vapor 33%
• Bond Integrity 33%
• Shear Bond Strength 33%
• Thermal Fusion 33%
• Serpentine Structure 33%
• Wall Integrity 33%

Engineering

• Substrates 100%
• Application 100%
• High Resolution 100%
• Multichannel 100%
• Bond Strength 100%
• High Strength 100%
• Chip Device 100%
• Loss 66%
• Reduction 66%
• Performance Bond 66%
• Temperature 33%
• Demonstrates 33%
• Performance 33%
• Environmental Condition 33%
• Low-Temperature 33%
• Thickness 33%
• Shallower 33%
• Tensiles 33%
• Alignment 33%
• Large Area 33%
• Bonding Process 33%
• Microfluidic Device 33%
• Transition Temperature 33%
• Area Substrate 33%
• Bonding Layer 33%
• Channel Depth 33%
• Prior Exposure 33%